JPH0367338B2 - - Google Patents

Info

Publication number
JPH0367338B2
JPH0367338B2 JP59044303A JP4430384A JPH0367338B2 JP H0367338 B2 JPH0367338 B2 JP H0367338B2 JP 59044303 A JP59044303 A JP 59044303A JP 4430384 A JP4430384 A JP 4430384A JP H0367338 B2 JPH0367338 B2 JP H0367338B2
Authority
JP
Japan
Prior art keywords
camera
height
capillary
substrate
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59044303A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60189231A (ja
Inventor
Yutaka Makino
Takeichi Yoshida
Seishiro Yanaike
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59044303A priority Critical patent/JPS60189231A/ja
Publication of JPS60189231A publication Critical patent/JPS60189231A/ja
Publication of JPH0367338B2 publication Critical patent/JPH0367338B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59044303A 1984-03-08 1984-03-08 ワイヤボンデイング装置 Granted JPS60189231A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59044303A JPS60189231A (ja) 1984-03-08 1984-03-08 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59044303A JPS60189231A (ja) 1984-03-08 1984-03-08 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS60189231A JPS60189231A (ja) 1985-09-26
JPH0367338B2 true JPH0367338B2 (en]) 1991-10-22

Family

ID=12687724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59044303A Granted JPS60189231A (ja) 1984-03-08 1984-03-08 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS60189231A (en])

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6249234B1 (en) 1994-05-14 2001-06-19 Absolute Sensors Limited Position detector
US20030062889A1 (en) 1996-12-12 2003-04-03 Synaptics (Uk) Limited Position detector
US6788221B1 (en) 1996-06-28 2004-09-07 Synaptics (Uk) Limited Signal processing apparatus and method
AU7665998A (en) * 1997-05-28 1998-12-30 Absolute Sensors Limited Transducer and method of manufacture
GB9720954D0 (en) 1997-10-02 1997-12-03 Scient Generics Ltd Commutators for motors
GB9721891D0 (en) 1997-10-15 1997-12-17 Scient Generics Ltd Symmetrically connected spiral transducer
GB9811151D0 (en) 1998-05-22 1998-07-22 Scient Generics Ltd Rotary encoder
CA2352363A1 (en) 1998-11-27 2000-06-08 Synaptics (Uk) Limited Position sensor
US7019672B2 (en) 1998-12-24 2006-03-28 Synaptics (Uk) Limited Position sensor
AU2002326008A1 (en) 2001-05-21 2003-01-02 Synaptics (Uk) Limited Position sensor
GB2403017A (en) 2002-03-05 2004-12-22 Synaptics Position sensor
US7907130B2 (en) 2002-06-05 2011-03-15 Synaptics (Uk) Limited Signal transfer method and apparatus
GB0317370D0 (en) 2003-07-24 2003-08-27 Synaptics Uk Ltd Magnetic calibration array
GB0319945D0 (en) 2003-08-26 2003-09-24 Synaptics Uk Ltd Inductive sensing system
GB2488389C (en) 2010-12-24 2018-08-22 Cambridge Integrated Circuits Ltd Position sensing transducer
GB2503006B (en) 2012-06-13 2017-08-09 Cambridge Integrated Circuits Ltd Position sensing transducer

Also Published As

Publication number Publication date
JPS60189231A (ja) 1985-09-26

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term